Honda And IBM Sign MOU To Drive Development Of Semiconductor Technologies For Software-Defined Vehicles
Honda Motor Co., Ltd. (Honda) and IBM have signed a Memorandum of Understanding (MOU) to embark on the long-term joint research and development of next-generation semiconductor and software technologies essential for the future of software-defined vehicles (SDVs). This partnership aims to tackle significant challenges associated with processing capability, power consumption, and design complexity, which are crucial for the realization of advanced SDVs.
As the automotive industry progresses towards 2030 and beyond, the integration of intelligence and AI technologies is expected to surge, paving the way for the development of SDVs. Honda and IBM foresee that these vehicles will require semiconductors with significantly higher processing performance and lower power consumption than those in conventional mobility products. The collaboration seeks to develop specialized semiconductor technologies, including brain-inspired computing and chiplet technologies, to meet these demands.
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